Feature
Packaging Considerations for Optoelectronics Devices
Over the next decade, the design of optoelectronics packaging will require significant changes to be cost-effective and easily manufactured. Benzoni, Anigbo, and Dudley discuss the challenges involved in achieving these changes and offer some guidelines for creating inexpensive, robust packaging.
Log in or become a member to view the full text of this article.
This article may be available for purchase via the search at Optica Publishing Group.
Optica Members get the full text of Optics & Photonics News, plus a variety of other member benefits.